The landscape of computing has drastically transformed over the years. What was once considered a luxury is now an essential part of our day-to-day lives. With the rise of applications like machine learning and the impending rollout of 5G mobile networks, the demand for high computing performance has reached new heights. In response to this growing need, the development of energy-efficient and cost-effective systems like “chiplets” has become imperative.
So, what exactly are chiplets? Essentially, a chiplet is an unpackaged die that can be integrated into a package along with other chiplets within a chip. Each chiplet is designed to perform a specific function, contributing to the overall computing capabilities of the system. The approach to chiplets may vary, but the fundamental idea remains the same – assembling a selection of chiplets from a library and connecting them using a die-to-die interconnect scheme.
Jingtong Hu, an associate professor at the University of Pittsburgh, has recognized the challenges posed by the increasing on-package routing density and data rates in high-speed interchiplet serial links. In response to these issues, Hu and his team have developed SPIRAL, a framework for signal-power integrity co-analysis of such links. SPIRAL leverages machine-learning based transmitter models and impulse response-based models for channels and receivers to build equivalent representations of the interchiplet links. By co-analyzing signal and power integrity, SPIRAL addresses the complex signal and power integrity issues that arise with chiplet technology.
While the Simulation Program with Integrated Circuit Emphasis (SPICE) has been a staple in the design and validation of circuit designs, it falls short when it comes to the analysis of chiplets. Hu points out that SPICE lacks the accuracy needed for the analysis and validation of chiplet technology due to its novelty. By introducing SPIRAL as an improvement over SPICE, Hu aims to provide a more efficient and effective tool for the design and testing of chiplet-based systems.
The emergence of chiplets as a solution for high-performance computing applications signifies a significant shift in the industry. With innovations like SPIRAL paving the way for more advanced analysis and validation tools, the future of computing looks promising. As technology continues to evolve, chiplets are set to play a pivotal role in meeting the ever-increasing demands of modern computing systems.
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